Hello and welcome to Chips Out Loud. In each episode we'll discuss emerging technologies in the Memory and Storage space. We’ll also focus on the customer needs that shape evolving modern client devices as well as next generation data centers.
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episode 9: Micron’s Journey to 232L Tech
In this episode, Russ Meyer, Corporate Vice President Non-Volatile Memory, drops by to talk about the announcement of 232-layer memory in Micron’s new 3D NAND offering.
“I think everybody's aware of the torrential pace of NAND scaling over the last decades and this 232-layer technology is the next progression to enable that scaling,” Meyer states. “That scaling, as we all know, has been a foundation for the revolution that we're all living through, the way we interact with the data..”
Host Jim Greene queries Russ on a bevy of topics: Why do layers matter and what makes stacking them difficult from a design perspective, the importance of suppliers in the mix, and the global view of NAND development.
Check out the new technologies at www.micron.com/mobile and learn more about Micron at www.micron.com/careers .